Material Composition

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6  Non-hybrid  devices found

Non-hybrid devices

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Base part Part Status HF Exempt Excel IPC1752 PDF IPC175X XML IPC1752A XML  Mold Compound-Black   Die Attach Epoxy   Die   Wire Bond - Au   Imaging Lens   Lid Attach   Substrate   TOTAL 
Phenolic Resin
[%]
Oxirane
[%]
1,4-Bis(2,3-epoxypropoxy)butane
[%]
Carbon Black (C)
[%]
Fused Silica (SiO2)
[%]
Silica Crystalline (SiO2)
[%]
Weight
[mg]
2,2-bis(acryloyloxymethyl)butyl acrylate
[%]
Imidazole Addition
[%]
Epoxy Phenol Novolak Resin
[%]
Silica (SiO2)
[%]
Weight
[mg]
Misc.
[%]
Silicon (Si)
[%]
Aluminum (Al)
[%]
Weight
[mg]
Gold (Au)
[%]
Weight
[mg]
Sulfur (S)
[%]
Titanium Dioxide (TiO2)
[%]
Sodium Monoxide (Na2O)
[%]
Boron Trioxide (B2O3)
[%]
Zinc Monoxide (ZnO)
[%]
Aluminum Trioxide (Al2O3)
[%]
Potassium Monoxide (K2O)
[%]
Silica Crystalline (SiO2)
[%]
Weight
[mg]
3,4-EPOXYCYCLOHEXYLMETHYL
[%]
2,3-epoxypropyl-trimethoxysilan
[%]
1,6-Bis(2,3-epoxypropoxy)naphthalene
[%]
Inorganic filler
[%]
Weight
[mg]
Fiber Glass (SiO2)
[%]
Inorganic filler
[%]
Inorganic Filler of Solder Mask_Talc (Mg3Si4O10(OH)2)
[%]
Silica Amorphous (SiO2)
[%]
Acetophenone Derivative
[%]
Carbon Black (C)
[%]
2,4-Diethyl-9H-thioxanthen-9-one (DETX)
[%]
Solvent Naphtha (Solvent oil)
[%]
Copper (Cu)
[%]
Barium Sulfate (BaSO4)
[%]
Weight
[mg]
Weight
[mg]
proprietary data 39817-09-9 2425-79-8 1333-86-4 60676-86-0 14808-60-7 n/a 15625-89-5 68490-66-4 28064-14-4 14464-46-1 n/a proprietary data 7440-21-3 7429-90-5 n/a 7440-57-5 n/a 7704-34-9 13463-67-7 1313-59-3 1303-86-2 1314-13-2 1344-28-1 12136-45-7 14808-60-7 n/a 2386-87-0 2530-83-8 27610-48-6 7727-43-7, 14807-96-6 n/a 65997-17-3 proprietary data 14807-96-6 7631-86-9 proprietary data 1333-86-4 82799-44-8 64742-94-5 7440-50-8 7727-43-7 n/a n/a
XGS16000 NOIX1SE016KB-LTI Active  Y   Download xls Download xml Download xml Download xml  15   15   3   1   64   2   377.95   75   3   15   7   83.58   0.38   98.63   0.99   406.14   100   2.21   0.5   5   5   5   5   5   5   69.5   865.32   5   5   75   15   7.96   21.2   13.08   1.31   0.32   1.96   0.33   0.33   3.92   47.42   10.13   331.71   2074.87 
XGS16000 NOIX1SN016KB-LTI Active  Y   Download xls Download xml Download xml Download xml  15   15   3   1   64   2   377.95   75   3   15   7   83.58   0.38   98.63   0.99   406.14   100   2.21   0.5   5   5   5   5   5   5   69.5   865.32   5   5   75   15   7.96   21.2   13.08   1.31   0.32   1.96   0.33   0.33   3.92   47.42   10.13   331.71   2074.87 
XGS16000 NOIX2SE016KB-LTI Active  Y   Download xls Download xml Download xml Download xml  15   15   3   1   64   2   377.95   75   3   15   7   83.58   0.38   98.63   0.99   406.14   100   2.21   0.5   5   5   5   5   5   5   69.5   865.32   5   5   75   15   7.96   21.2   13.08   1.31   0.32   1.96   0.33   0.33   3.92   47.42   10.13   331.71   2074.87 
XGS16000 NOIX2SN016KB-LTI Active  Y   Download xls Download xml Download xml Download xml  15   15   3   1   64   2   377.95   75   3   15   7   83.58   0.38   98.63   0.99   406.14   100   2.21   0.5   5   5   5   5   5   5   69.5   865.32   5   5   75   15   7.96   21.2   13.08   1.31   0.32   1.96   0.33   0.33   3.92   47.42   10.13   331.71   2074.87 
XGS16000 NOIX3SE016KB-LTI Active  Y   Download xls Download xml Download xml Download xml  15   15   3   1   64   2   377.95   75   3   15   7   83.58   0.38   98.63   0.99   406.14   100   2.21   0.5   5   5   5   5   5   5   69.5   865.32   5   5   75   15   7.96   21.2   13.08   1.31   0.32   1.96   0.33   0.33   3.92   47.42   10.13   331.71   2074.87 
XGS16000 NOIX3SN016KB-LTI Active  Y   Download xls Download xml Download xml Download xml  15   15   3   1   64   2   377.95   75   3   15   7   83.58   0.38   98.63   0.99   406.14   100   2.21   0.5   5   5   5   5   5   5   69.5   865.32   5   5   75   15   7.96   21.2   13.08   1.31   0.32   1.96   0.33   0.33   3.92   47.42   10.13   331.71   2074.87 
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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.  

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products. 

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.


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