ESD7382: Micro−Packaged Diodes for ESD Protection

Description: The ESD7382 is designed to protect voltage sensiti...
  • The ESD7382 is designed to protect voltage sensitive components that require ultra−low capacitance from ESD events. Excellent clamping capability, low capacitance, low leakage, and fast response time, make these parts ideal for ESD protection on designs where board space is at a premium. Because of its low capacitance, it is suited for use in high frequency designs such as USB 2.0 high speed and antenna line applications.
  • Features
  • Ultra−Low Capacitance: 0.37 pF
  • Low Clamping Voltage
  • Small Body Outline Dimensions: 0.60 mm x 0.30 mm
  • Low Body Height: 0.3 mm
  • Stand−off Voltage: 5.0 V
  • Low Leakage
  • Insertion Loss: 0.030 dBm
  • Response Time is < 1 ns
  • Low Dynamic Resistance < 1
  • IEC61000−4−2 Level 4 ESD Protection
  • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant
  • Applications
  • RF Signal ESD Protection
  • RF Switching, PA, and Antenna ESD Protection
  • Near Field Communications
  • Technical Documentation & Design Resources
    Availability and Samples
    ESD7382MUT5G
  • Status: Active
  • Compliance: Pb-free Halide free 
  • Description: Micro−Packaged Diodes for ESD Protection
  • Package Type: X3DFN-2
  • Package Case Outline: 152AF
  • MSL: 1
  • Container Type: REEL
  • Container Qty: 10000
  • Specifications
  • Interface: General I/O  USB 3.0  USB 2.0 
  • Number of Lines:
  • Direction: Unidirectional 
  • C Max (pF): 0.55 
  • V(BR) Min (V): 5.2 
  • VRWM Max (V):
  • IR Max (µA):
  • PPK Max (W): 30 
  • Package Type: X3DFN-2 
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