FDMF3180: Intelligent Power Module (IPM) with Integrated Current and Temperature Monitors

Description: The FDMF3180 is the latest generation Intelligent ...
  • The FDMF3180 is the latest generation Intelligent Power Module (IPM) for high-current, high frequency, synchronous DC-DC buck converter applications. It integrates fully optimized High Side and Low Side PowerTrench® 11 power MOSFETs with an advanced driver IC featuring current and temperature sensors.
    With an integrated approach, the SPS switching power stage is optimized for driver and MOSFET dynamic performance, minimized system inductance, and power MOSFET RDS(ON).
    The integration of Power MOSFETs with a driver IC enables advanced high accuracy module thermal and current monitoring. The FDMF3180 provides an output signal (IMON), which reports the real-time module current. IMON is a very accurate, 5μA/A signal representing the real-time Power MOSFET drain currents. The IMON signal can be used to replace output filter inductor DCR current sense or resistor sense methods.
    The FDMF3180 also includes very accurate module thermal monitor (TMON). TMON is a voltage sourced PTAT signal that is calibrated to provide a 0.8 V output at 25°C with an 8 mV / °C slope.
  • Features
  • ON’s PowerTrench® 11 MOSFET Technology: ~0.5% Higher Peak Efficiency vs. Prior Generation
  • 30 V/25 V Breakdown Voltage MOSFETs to Ensure Long Term Reliability
  • Up to 70 A of Peak Current Handling Capability
  • High-Performance, 5 mm x 6 mm, Universal Footprint PQFN Package
  • Integrated Current Monitor (IMON) Compliant with Intel’s VR13 Accuracy Requirements
  • Integrated Temperature Monitor (TMON)
  • Catastrophic Fault Detection Features
  • Thermal Flag (OTP) for Over-Temperature Condition
  • Over-Current Protection FAULT (OCP)
  • High--Side Short Detect FAULT
  • Under-Voltage Lockout (UVLO) on VCC and PVCC
  • Technical Documentation & Design Resources
    Availability and Samples
  • Status: Active
  • Compliance: Pb-free Halide free 
  • Description: Intelligent Power Module (IPM) with Integrated Current and Temperature Monitors
  • Package Type: PQFN-39
  • Package Case Outline: 483BF
  • MSL: 1
  • Container Type: REEL
  • Container Qty: 3000
  • Specifications
  • Family: Next Gen SPS 
  • Rated Voltage Min (V):
  • IO @ 25 °C Min (A): 70 
  • VCE(sat) @ 25 °C Typ (V):
  • RDS(on) (Ω):
  • Emitter Configuration:
  • Shutdown Pin: Yes 
  • Package Type: PQFN-39 
  • ON Semiconductor Full Web Site