FXLA2203: Dual-Mode Dual-SIM Card Level Translator
Description: The FXLA2203 allows either two hosts to simultaneo...
The FXLA2203 allows either two hosts to simultaneously communicate with two Subscriber Identity Modules (SIM), or two User Identity Modules (UIM). Dual Mode refers to the mobile phones that are compatible with more than one form of data transmission or network (such as GSM, CDMA, WCDMA, TDSCDMA, or CDMA2000), resulting in a dual-baseband processor configuration. In a dual-mode application, the FXLA2203 host ports interface directly with the baseband processors.
The bi-directional I/O open-drain channel features auto-direction and internal 10KΩ pull-up resistors. RST and CLK provide unidirectional translation from host to card only.
Either host can swap SIM slots with the assertion of a single control pin: CH_Swap. The typical channel swap time is 130ns.
The FXLA2203 does not contain internal Low Dropout Regulator (LDOs). Instead, the FXLA2203 architecture incorporates two low-RON internal power switches for routing existing PMIC (Power Management Integrated Circuit) LDOs to individual SIM slots. This reduces overall system power, leverages existing LDO system resources, and aligns with the philosophy that centralizing LDOs in the PMIC facilitates power management. Since the FXLA2203 does not block the LDO function to the SIM card, existing activation / deactivation timing transparency is maintained between Hosts, PMICs, and SIM cards.
The device allows voltage translation from as high as 3.6V to as low as 1.65V. Each port tracks its own port power supply.
Easy-to-Use "Single Pin" SIM Card Swap Control
Channel Swap Time: 130ns (Typical)
Simultaneous Dual-Mode, Dual-SIM Communication
Host Ports: 1.65V to 3.6V Voltage Translation
Card Ports: 1.65V to 3.6V Voltage Translation
Leverages the Presence of Existing PMIC LDOs
Power Switch RON: 0.5Ω (Typical)
Supports Class B 3V SIM / UIM Cards
Supports Class C: 1.8V SIM / UIM Cards
Non-Preferential Host VCC Power-Up Sequencing
Activation / Deactivation Timing Compliant per ISO7816-03
Internal Pull up Resistors for Bi-Directional I/O Pin
Outputs Switch to 3-State if Host VCC at GND
Direction Control Not Needed
Packaged in 24-Terminal UMLP (2.5mm x 3.5mm)
ESD Protection Exceeds 18kV IEC 61000-4-2 (System-Level ESD)
This product is general usage and suitable for many different applications.
Technical Documentation & Design Resources
Availability and Samples
Compliance: Pb-free Halide free
Description: Dual-Mode Dual-SIM Card Level Translator
Package Type: UQFN-24
Package Case Outline: 523AX
Container Type: REEL
Container Qty: 5000
VCC Min (V):
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tpd Max (ns):
IO Max (mA):