MC74AC11: Triple 3-Input AND Gate

Description: MC74AC11...

Features

Technical Documentation & Design Resources

• Simulation Models (2)
• Data Sheets (1)
• Package Drawings (1)

Product Change Notification

• 1Q2013 Product Discontinuance Notice

  PRODUCT DISCONTINUANCE

• Update to FACT Integrated Circuits Die Manufacturing Facility from ON Semiconductor Aizu (Japan) to Tower Semiconductor (Israel) - FPCN16582 (SOIC Package) and FPCN16582A (TSSOP Package)

  UPDATE NOTIFICATION

• Final Notification for FACT Integrated Circuits Die Manufacturing Facility from ON Semiconductor Aizu (Japan) to Tower Semiconductor (Israel).

  FINAL PRODUCT/PROCESS CHANGE NOTIFICATION

• Final Notification for FACT Integrated Circuits Die Manufacturing Facility from ON Semiconductor Aizu (Japan) to Tower Semiconductor (Israel)

  FINAL PRODUCT/PROCESS CHANGE NOTIFICATION

• 1Q11 (1st QUARTER 2011) Product Discontinuance Notice

  PRODUCT DISCONTINUANCE

• Initial Notification for FACT Integrated Circuits Die Manufacturing Facility from ON Semiconductor Aizu (Japan) to Tower Semiconductor (Israel).

  INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION

• Shipping Tube change for SOIC Narrow Body (SOIC NB) devices and QSOP at ON Semiconductor Carmona, Philippines

  PRODUCT BULLETIN

• Special Leaded Product Discontinuance Notice

  PRODUCT DISCONTINUANCE

• 45 DAYS TO ORDER DEVICES LISTED IN PRODUCT DISCONTINUANCE NOTICE 15180

  UPDATE NOTIFICATION

• FINAL NOTIFICATION FOR SOEIAJ 14/16/20L ASSEMBLY SITE TRANSFER TO MITSUI, JAPAN

  FINAL PRODUCT/PROCESS CHANGE NOTIFICATION

• Initial Notification � SOEIAJ 14/16/20L Assembly Site Transfer to Mitsui, Japan

  INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION

• Lead Free Products Marking Identification

  PRODUCT BULLETIN

• Standard Components Low Sales Devices Product Discontinuance

  PRODUCT DISCONTINUANCE

• Final Notification for Standard Logic SOIC and TSSOP Additional Wire Size Qualification

  INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION

• Update Notification for PCN10130

  UPDATE NOTIFICATION

• Three Layer Pre-Plated L/Frames 8/14/16 SOIC Qual

  PRODUCT/PROCESS CHANGE NOTIFICATION

• Traceability Code Correction for PB 10100

  PRODUCT BULLETIN

• Emboss Tape and Reel Material Change for MFP(SO EIAJ T2)/TSSOP Products

  PRODUCT/PROCESS CHANGE NOTIFICATION

• Date Code Format Change for MFP(SO EIAJ T2)

  PRODUCT BULLETIN

• End of Life of Sticky Tape and Reel for MFP(SO EIAJ T2) Products (L1/L2/R1/R2)

  PRODUCT DISCONTINUANCE

• MFP14/16/20,LQFP32(7X7) Assembly and Test Site Transfer to Motorola Taiwan

  PRODUCT/PROCESS CHANGE NOTIFICATION

• End of Life for MC74AC/TXXX Device Types

  PRODUCT DISCONTINUANCE

Availability and Samples

Packages

Specifications