NUP2301: Low Capacitance Diode Array for ESD Protection

Description: The NUP2301MW6 is a micro-integrated device design...
  • The NUP2301MW6 is a micro-integrated device designed to provide protection for sensitive components from possible harmful electrical transients such as ESD.
  • Features
  • Low Capacitance (2.0 pF Max Between I/O Lines
  • Single Package Integration Design
  • Provides ESD Protection for JEDEC Standards JESD22
  • Protection for IEC61000-4-2 (Level 4)
  • Ensures Data Line Speed and Integrity
  • Directs the Transient to Either Positive Side or to Ground
  • AEC-Q101 Qualified and PPAP Capable
  • SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements
  • Applications
  • T1/E1 Secondary IC Protection
  • T3/E3 Secondary Protection
  • HDSL, IDSL Secondary IC Protection
  • Video Line Protection
  • MicroController Input Protection
  • Base Stations
  • Technical Documentation & Design Resources
    Product Change Notification
    Availability and Samples
    NUP2301MW6T1G
  • Status: Active
  • Compliance: Pb-free Halide free 
  • Description: Low Capacitance Diode Array for ESD Protection
  • Package Type: SC-88-6 / SC-70-6 / SOT-363-6
  • Package Case Outline: 419B-02
  • MSL: 1
  • Container Type: REEL
  • Container Qty: 3000
  • Inventory

  • Market Leadtime (weeks):Contact Factory
  • Arrow:0
  • Digikey:>10K
  • Newark:>1K
  • Newark:>1K
  • PandS:>50K
  • SZNUP2301MW6T1G
  • Status: Active
  • Compliance: AEC Qualified PPAP Capable Pb-free Halide free 
  • Description: Low Capacitance Diode Array for ESD Protection
  • Package Type: SC-88-6 / SC-70-6 / SOT-363-6
  • Package Case Outline: 419B-02
  • MSL: 1
  • Container Type: REEL
  • Container Qty: 3000
  • Inventory

  • Market Leadtime (weeks):2 to 4
  • Arrow:0
  • Digikey:>1K
  • Mouser:>1K
  • ON Semiconductor:555,000
  • NUP2301MW6T1
  • Status: Obsolete
  • Compliance: 
  • Description: Low Capacitance Diode Array for ESD Protection
  • Package Type: SC-88-6 / SC-70-6 / SOT-363-6
  • Package Case Outline: 419B-02
  • MSL: 1
  • Container Type: REEL
  • Container Qty: 3000
  • Packages
    Specifications
  • Interface: T1/E1, T3/E3 
  • Number of Lines:
  • Direction: Bidirectional 
  • C Max (pF):
  • V(BR) Min (V): 70 
  • VRWM Max (V): 70 
  • IR Max (µA): 2.5 
  • PPK Max (W):
  • Package Type: SC-88-6 / SC-70-6 / SOT-363-6 
  • ON Semiconductor Full Web Site