MC74VHCT240A: Octal Inverting Buffer/Line Driver, 3-State Output
Description: The MC74VHCT240A is an advanced high speed CMOS oc...
The MC74VHCT240A is an advanced high speed CMOS octal bus buffer fabricated with silicon gate CMOS technology. It achieves high speed operation similar to equivalent Bipolar Schottky TTL while maintaining CMOS low power dissipation.
The MC74VHCT240A is an inverting 3-state buffer, and has two active-low output enables. This device is designed to be used with 3-state memory address drivers, etc.
The VHCT inputs are compatible with TTL levels. This device can be used as a level converter for interfacing 3.3V to 5.0V, because it has full 5V CMOS level output swings.
The VHCT240A input and output (when disabled) structures provide protection when voltages between 0V and 5.5V are applied, regardless of the supply voltage. These input and output structures help prevent device destruction caused by supply voltage - input/output voltage mismatch, battery backup, hot insertion, etc.
Features
High Speed: tPD = 5.6ns (Typ) at VCC = 5V
Low Power Dissipation: ICC = 4µA (Max) at TA = 25 C
TTL-Compatible Inputs: VIL = 0.8V; VIH = 2.0V
Power Down Protection Provided on Inputs and Outputs
Balanced Propagation Delays
Designed for 4.5V to 5.5V Operating Range
Low Noise: VOLP = 1.1V (Max)
Pin and Function Compatible with Other Standard Logic Families
Latchup Performance Exceeds 300mA
ESD Performance: HBM > 2000V; Machine Model > 200V
Chip Complexity: 110 FETs or 27.5 Equivalent Gates
Pb-Free Packages are Available*
Technical Documentation & Design Resources
Product Change Notification
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4Q2011 Product Discontinuance Notice
PRODUCT DISCONTINUANCE
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4Q10 Product Discontinuance Notice
PRODUCT DISCONTINUANCE
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TSSOP Tube Dimension change: Tube width from 6.858mm to 8.44mm and Pedestal height from 1.397mm to 1.55mm
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
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2008 (Second Half 2008) Leaded Parts to Lead Free Parts Standard Conversion EOL &
PRODUCT DISCONTINUANCE
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FPCN SOIC WB EXPANSION FOR OSPI
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
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Qualification of OSPI for Assembly/Test of 8/14/16/20/24/28 Lead SOIC Wide and Narrow Body Packages
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
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Initial Notification of Qualification of OSPI for Assembly/Test of 16/20/24/28 Lead SOIC Wide Body Packages
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION
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45 DAYS TO ORDER DEVICES LISTED IN PRODUCT DISCONTINUANCE NOTICE 15180
UPDATE NOTIFICATION
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FINAL NOTIFICATION FOR SOEIAJ 14/16/20L ASSEMBLY SITE TRANSFER TO MITSUI, JAPAN
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
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Update Notification - PB14235 Marking Type Change from Ink to Laser - ASECL
UPDATE NOTIFICATION
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Pb Free (Lead Free) Part Number 16 Character Nomenclature Set-Up
PRODUCT BULLETIN
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Initial Notification � SOEIAJ 14/16/20L Assembly Site Transfer to Mitsui, Japan
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION
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Update Notification to 15006 Intrinsic Lead (Pb) Free Product Part Number Change
UPDATE NOTIFICATION
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Intrinsic Lead (Pb) Free Product Part Number Change
PRODUCT BULLETIN
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Marking Type Change from Ink to Laser at ASECL
PRODUCT BULLETIN
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Addition of Tower Semiconductor Fab for Minigate, LCX, LVX, Analog Switch and VHC Logic Products
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
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Addition of Tower Semiconductor Fab for Minigate, LCX, LVX, Analog Switch and VHC Logic Products
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
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Addition of Tower Semiconductor Fab for Minigate, LCX, LVX, Analog Switch and VHC Logic Products
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
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Lead Free Products Marking Identification
PRODUCT BULLETIN
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Addition of Tower Fab for Minigate, LCX, VHC, FST and Analog Switch Products
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION
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Update Notice for #12434: Standard Components Low Sales Devices Product Discontinuance
UPDATE NOTIFICATION
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Standard Components Low Sales Devices Product Discontinuance
PRODUCT DISCONTINUANCE
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Final Notification for Standard Logic SOIC and TSSOP Additional Wire Size Qualification
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION
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Addition of Tower Semiconductor as a Qualified Wafer Fabrication Site
PRODUCT/PROCESS CHANGE NOTIFICATION
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Traceability Code Correction for PB 10100
PRODUCT BULLETIN
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Emboss Tape and Reel Material Change for MFP(SO EIAJ T2)/TSSOP Products
PRODUCT/PROCESS CHANGE NOTIFICATION
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Date Code Format Change for MFP(SO EIAJ T2)
PRODUCT BULLETIN
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End of Life of Sticky Tape and Reel for MFP(SO EIAJ T2) Products (L1/L2/R1/R2)
PRODUCT DISCONTINUANCE
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14/16/20L TSSOP 3-Layer Pre-Plated Frames
PRODUCT/PROCESS CHANGE NOTIFICATION
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Addition of Chartered Semconductor as a Qualified Wafer Fabrication Site for VHC and LVX Devices
PRODUCT/PROCESS CHANGE NOTIFICATION
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MFP14/16/20,LQFP32(7X7) Assembly and Test Site Transfer to Motorola Taiwan
PRODUCT/PROCESS CHANGE NOTIFICATION
Availability and Samples
MC74VHCT240ADTRG
Status: Active
Compliance: Pb-free Halide free
Description: Octal Inverting Buffer/Line Driver, 3-State Output
Package Type: TSSOP-20
Package Case Outline: 9.48
MSL: 1
Container Type: REEL
Container Qty: 2500
Inventory
Market Leadtime (weeks):2 to 4
Arrow:0
Digikey:>1K
ON Semiconductor:30,000
MC74VHCT240ADWRG
Status: Active
Compliance: Pb-free Halide free
Description: Octal Inverting Buffer/Line Driver, 3-State Output
Package Type: SOIC-20W
Package Case Outline: 751D-05
MSL: 3
Container Type: REEL
Container Qty: 1000
Inventory
Market Leadtime (weeks):2 to 4
Arrow:0
ON Semiconductor:9,000
Specifications
Channels:
8 
Output:
3-State 
VCC Min (V):
4.5 
VCC Max (V):
5.5 
tpd Max (ns):
8.8 
IO Max (mA):
8 
Package Type:
TSSOP-20 
SOIC-20W