PCRKA20065F8M1: Extremefast (EF) diode, 650 V, 200 A, Bare Die with Solderable Top Metal. Pairing with PCGA200T65NF8M1

Description: This 650V Extremefast (EF) diode Bare Die has a di...
  • This 650V Extremefast (EF) diode Bare Die has a die size of 10mm x 5mm. Its anode pad (top side) is covered with Ni/Ag solderable top metal, which enables advanced power module assembly technologies for top side connection, including Ag Sintering and Cu bare soldering, etc.
  • Features
  • AEC-Q101 Qualified - Pass 100% HTRB test which gives better reliability performance than parts passing older versioin AEC-Q101
  • Maximum Junction Temperature 175°C - More thermal margin than conventional 150°C rated bare die products
  • Low forward voltage: VF=1.35V(Typ.)@IF=200A
  • Extremefast Technology with soft recovery
  • Final Solderable Metal Layer
  • Applications
  • Automotive Traction Modules
  • General Power Modules
  • End Products
  • xEV
  • Technical Documentation & Design Resources
    Availability and Samples
    PCRKA20065F8M1
  • Status: Active
  • Compliance: AEC Qualified PPAP Capable Pb-free Halide free 
  • Description: Extremefast (EF) diode, 650 V, 200 A, Bare Die with Solderable Top Metal. Pairing with PCGA200T65NF8M1
  • Package Type: 
  • Package Case Outline: 
  • MSL: NA
  • Container Type: MTFRM
  • Container Qty: 1
  • Specifications
  • V(BR)CES Typ (V):  
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  • Co-Packaged Diode:  
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